NCKU, TIT, and NARLabs TSRI Collaborate on Next Generation Heterogeneous Integration Technology
The tripartite partnership between National Cheng Kung University (NCKU), the Tokyo Institute of Technology (TIT/Tokyo Tech), and the Taiwan Semiconductor Research Institute (NARLabs TSRI) is set to revolutionize the semiconductor industry with advanced packaging and heterogeneous integration technologies. This collaboration aims to strengthen academic capabilities, enhance industrial links, and cultivate high-level talents to meet the challenges of the New AI Era.
At the Taiwan-Japan Forum on Next Generation Heterogeneous Integration Technology, held on July 11th, 2024, leaders from the three institutions, including President Meng-Ru Shen of NCKU, President Kazuya Masu of Tokyo Tech, and Dr. Tuo-Hung Hou of NARLabs TSRI, made a joint declaration to solidify their partnership. By combining Taiwan’s expertise in semiconductor manufacturing with Japan’s strengths in materials and equipment, this collaboration is expected to accelerate breakthroughs in industrial technology.
The forum brought together distinguished guests from both countries, including academics, researchers, and industry professionals, to discuss the latest advancements in semiconductor technology. President Shen highlighted the importance of collaboration in driving innovation and technological advancements, while President Masu emphasized the shared history and origins of NCKU and Tokyo Tech as Technical Colleges.
Dr. Hou underscored the significance of advanced packaging in next-generation applications such as communications, high-performance computing, and AIoT. The collaboration between NCKU, Tokyo Tech, and NARLabs TSRI aims to establish advanced stack packaging verification technology for large-scale integration, enabling faster technology development and verification.
Overall, the tripartite partnership between NCKU, Tokyo Tech, and NARLabs TSRI is poised to propel the semiconductor industry forward and cultivate a new generation of talents to lead the way in the New AI Era.